This course covers phases 1 and 2 of the smart card lifecycle: chip and card manufacturing.

Chip manufacturing covers:

1. Chip design
2. Smart card operating systems (COS)
3. ROM masks and fabrication of the semiconductor chips
4. Chip testing on the wafer
5. Attaching chips to modules
6. Encapsulating the chips in the modules
7. Module testing
8. Card manufacturing covers:
9. Card design and printing
10. Tape layering
11. Sheet collating
12. Sheet lamination
13. Card punching
14. Hot stamping
15. Chip module testing
16. Chip milling and implanting
17. Module lamination
18. RFID testing
19. Quality assurance
20. Packaging and Shipping to perso bureau